PCB设计中专业英译术语之基材：

　　1. 基材：base material

　　2. 层压板：laminate

　　3. 覆金属箔基材：metal-clad bade material

　　4. 覆铜箔层压板：copper-clad laminate (CCL)

　　5. 单面覆铜箔层压板：single-sided copper-clad laminate

　　6. 双面覆铜箔层压板：double-sided copper-clad laminate

　　7. 复合层压板：composite laminate

　　8. 薄层压板：thin laminate

　　9. 金属芯覆铜箔层压板：metal core copper-clad laminate

　　10. 金属基覆铜层压板：metal base copper-clad laminate

　　11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film

　　12. 基体材料：basis material

　　13. 预浸材料：prepreg

　　14. 粘结片：bonding sheet

　　15. 预浸粘结片：preimpregnated bonding sheer

　　16. 环氧玻璃基板：epoxy glass substrate

　　17. 加成法用层压板：laminate for additive process

　　18. 预制内层覆箔板：mass lamination panel

　　19. 内层芯板：core material

　　20. 催化板材：catalyzed board ,coated catalyzed laminate

　　21. 涂胶催化层压板：adhesive-coated catalyzed laminate

　　22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate

　　23. 粘结层：bonding layer

　　24. 粘结膜：film adhesive

　　25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film

　　26. 无支撑胶粘剂膜：unsupported adhesive film

　　27. 覆盖层：cover layer (cover lay)

　　28. 增强板材：stiffener material

　　29. 铜箔面：copper-clad surface

　　30. 去铜箔面：foil removal surface

　　31. 层压板面：unclad laminate surface

　　32. 基膜面：base film surface

　　33. 胶粘剂面：adhesive faec

　　34. 原始光洁面：plate finish

　　35. 粗面：matt finish

　　36. 纵向：length wise direction

　　37. 模向：cross wise direction

　　38. 剪切板：cut to size panel

　　39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)

　　40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)

　　41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates

　　42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates

　　43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates

　　44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates

　　45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates

　　46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

　　47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates

　　48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates

　　49. 超薄型层压板：ultra thin laminate

　　50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates

　　51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

　　以上即是PCB设计中专业英译术语之基材，下期预告：PCB设计中专业英译术语之基材的材料。